Two years ago we wrote about the crazy high yields of Zeppelin dies but, now, we are here to talk about the yelds of Zen2 dies (About 88 mm2). According to our sources, the same who told us about the death of Global Foundries 20nm, the fully working Zen2 dies are about the 70% of the total production (A separate discourse needs to be entered into for the frequencies).
Despite it doesn't sound great at first sight, that's a very good news. If we think that a fully working Intel XCC die (28 cores) has a rumored yield of 35%, this means that a 64C EPYC2 CPU has got a yield rate of 70% (8 x 8 dies). Almost the double of Intel yield rate!
So, we are curious to know EPYC 2 (And Ryzen 3000) prices.
Thermaltake New Level 20 Full-Tower Chassis
20 years of “Delivering the Perfect User Experience”
Thermaltake, celebrates the upcoming 20th anniversary by announcing the new Level 20 Full Tower Chassis. Thermaltake achieved several breakthroughs in terms of design and technology to design the new Level 20. Featuring a gaming oriented design with architectural aesthetics, the aluminum-made Level 20, utilizes an aerodynamic trio chamber structure to achieve ventilation and space management optimization. The three hinged swing-doors are made with premium-quality 4mm thick tempered glass windows that provide durability and superb viewing capability. The Level 20 is installed with latest USB 3.1 Type-C port to provide 10 GB/s of transmission speed. Furthermore the three built in Riing Plus 14 RGB Fans, two Lumi Plus LED Strips and one Riing Plus Digital Controller can all be controlled with the TT RGB PLUS Software. Users can custom control fan speeds and lighting effects to create their own unique liquid cooling gaming system. Compatible with the latest PC hardware, AIO and DIY liquid cooling solutions, the commemorative Level 20 Full Tower Chassis delivers not just an unprecedented design but also innovative performance.
TT PremiumTo continue achieving the corporate mission of delivering the perfect user experience, Thermaltake developed “TT Premium” with the essence of combining supreme quality products with a new logo design. TT Premium is far more than just a guarantee of quality. Behind the name, it represents the passion in DIY, Modding and Thermaltake’s desire to be the most innovative brand in the PC hardware market. To satisfy the demand of the high-end PC users, TT Premium follows its core values of Excellent Quality, Unique Design, Diverse Combinations and Boundless Creativity to provide a high performance PC product for every enthusiast.
Exclusively “Tt LCS Certified”Tt LCS Certified is a Thermaltake exclusive certification applied to products that pass the design and rigorous hardcore enthusiast standards that only the world’s best LCS chassis are held to. The Tt LCS certification was created so that we at Thermaltake can clearly convey to power users and enthusiasts which chassis are built and tested to be best compatible under extreme liquid cooling configurations. This ensures you get the best performance, compatibility and features.
Features of the Thermaltake Level 20 Full-Tower Chassis:Patented TT RGB PLUS Software & AppMonitor the fan performance, adjust the fan speeds, and customize the lighting effects for Thermaltake RGB PLUS series products with the patented TT RGB PLUS Software and exclusively designed mobile app.
SyncALL, Say "Hello TT" Thermaltake AI Voice ControlTalking to TT RGB PLUS App is an easier, faster way to control your system lights. You can ask it to turn the lights on or off, switch lights modes, dim the lights, change light colors, or adjust lights speeds or fan speeds.
Sync with Razer Chroma LightingAll Thermaltake TT RGB PLUS products are able to connect into the Razer Chroma ecosystem. Users who have installed both the TT RGB PLUS Software and Razer Synapse 3 can experience synchronized gaming and RGB lighting effects on their TT RGB PLUS liquid cooling system and gaming gear! From cooldown timers, health bars, and flashy ultimate indicators, to subtle ambient lighting that sets the perfect mood for each game, Razer Chroma provides an experience that transcends the screen and into your full setup, for a truly immersive experience.
Works with Amazon AlexaAll Thermaltake TT RGB PLUS products support Amazon Alexa Voice Service, allowing you to control the lights or fan speeds by talking to the Alexa-enabled device. With the support of the Amazon Alexa, TT RGB PLUS products also offer an additional visual cue for checking current weather condition in your location or anywhere in the world. All you have to do is simply start the sentence with “Alexa, tell Thermaltake”, then the color of the lights will correspond to the weather condition in the location.
Preinstalled with 3 Riing Plus 14 RGB Fans, 2 Lumi Plus LED Strips, and a Digital Lighting Controller3 Riing Plus 14 RGB Fans and 2 Lumi Plus LED Strips are built in to enhance the ventilation and light up the Level 20 with 16.8million distinctively gorgeous illuminating display colors. Both can be controlled by the patented TT RGB PLUS software through the included Digital Lighting Controller.
Individual Aerodynamic Chamber DesignLevel 20 utilizes the trio chamber design to achieve ventilation and space management optimization. By separating PSU, Motherboard, and Storage/LCS into different compartments, Level 20 creates an organized space that can be viewed through the high quality tempered glass windows. • PSU ChamberLevel 20 supports both vertical and horizontal PSU orientations, allowing versatile placement options. The PSU chamber features aluminum mesh panel to ensure thorough airflow and ventilation of the PSU. • Motherboard ChamberLevel 20 assures exceptional expendability, the motherboard chamber can support up to E-ATX motherboard and 360mm radiator as well as 3 x 120 or 2 x 140 mm fans. The motherboard chamber can also institute riser cable or AIO liquid cooling systems. • Storage/LCS ChamberIn the spirit of encouraging innovation and flexibility, Level 20’s third chamber is capable of instituting powerful data management or liquid-cooling solution system. The tempered glass door is perfect for showcasing components while the aluminum mesh panel ensures supreme airflow.
Aluminum Modular Structural Statement with 4mm Thick Tempered GlassThe Level 20 features aluminum panels created by high precision CNC digital cutting to ensure chassis security while providing futuristic gaming essence. The aluminum anodizing process establishes water and corrosion resistant panels. The aluminum casing utilizes CNC milling technology, and was sandblasted to construct elegant and sleek curves. Three hinged swing-doors made with premium-quality 4mm thick tempered glass guarantee window durability and viewing capability.
Built-in Thermaltake TT Gaming PCI-E 3.0 Riser CableThe included Thermaltake TT Gaming PCI-E 3.0 Riser Cable comes with premium quality, ultra-high speed cable and EMI shielding with conducting polymer to exceed user expectation. Users are allowed to choose the way they want to display graphics card or install the power supply vertically for ultimate system display.
Superior Hardware and LCS ExpansionEntailed with detailed functionality and immense storage with up to 11 drive locations for 3.5” or 2.5” devices; including 6 at the back of the motherboard chamber, 2 in front of the motherboard chamber, and 3 in the LCS chamber. The Level 20 also supports up to E-ATX motherboards, comes with cooling fitment for CPU coolers up to 200mm in height, VGA lengths up to 310mm and PSU sizes up to 220mm in length. The Level 20 enables users to build extreme air/liquid cooling systems with high-end, large graphics cards and incomparable storage.
Unparalleled AerodynamicsConstructed with individual chambers and aluminum mesh panels, along with three preinstalled 140mm Riing Plus LED RGB fans, the Level 20 provides efficient heat source is dissipation and perfect airflow modulation. Moreover, the isolation of high capacity radiators and fans allows for additional interior space without compromising the cooling performance.
Speedy Transmission (USB Type-C™ & USB 3.0)Thermaltake does not hesitate when it comes to pursuing the latest trends in the industry that can improve our products. The Level 20 is installed with the USB Type-C™ I/O port to provide 10G of transmission speed by each port. USB 3.0 I/O ports are also included.
For more details on Thermaltake Level 20 Full-Tower Chassis, please visit:
According to our sources, ATIC (Which owns about nine-tens of Globalfoundries) is in the process of looking for potential buyers for GlobalFoundries.
It’s not the first time we hear this rumor, but this time there will not be another IBM, ready to donate 1.5 billion dollars and the foundry business almost for free.
Recently GlobalFoundries has deleted the 7nm node, in order to bet on 14nm/12nm FinFET and FD-SOI nodes. As Daniel Nenni wrote, “GF will skip 7nm and below and join the ranks of UMC, SMIC, TowerJazz etc… as a boutique foundry which can be quite profitable. In fact, with CMOS, FinFET, and the FD-SOI offerings, I would crown GF the King of the Foundry Boutiques!”.
Yes, it’s a huge market, but will it be sustainable in the long run? Who know?
For this reason ATIC is looking for potential buyers. They now understand that the foundry business is not just a game where the guy who has more money wins (Intel anyone?).
So, before GlobalFoundries value sinks, they’re traying to sell it: “Take the Money and Run”.
As we said some week ago on Twitter, there is a huge possibility that Intel will spin off its own FABs, as IBM did just 3 years ago.
Developing a new node is today very expensive, and in the near future Intel may not have got enough money to invest in this sector due to AMD, ARM, and NVIDIA increased competition in different markets (Consumer PC, Server, HPC, etc).
According to latest rumors, Intel could spin-off its own FABs (Not like AMD did, but like IBM did). Time frame: 2020-2021.— Bits And Chips - Eng (@BitsAndChipsEng) 29 giugno 2018
According to latest rumors, Intel could spin-off its own FABs (Not like AMD did, but like IBM did). Time frame: 2020-2021.
Also, we know that next year AMD will have a huge advantage over Intel, thanks to TSMC 7nm node (EPYC Rome). So, Intel main goal is to not allow AMD to have the same advantage with the 5nm and 3nm nodes (2020-2021).
How? AMD and Intel will share almost the same nodes. Intel may sell to Global Foundries its FABs. Or Intel may create a Joint Venture with GloFo. We have to remember that Global Foundries has got the money of the Arabs and the Know-How of IBM, so it may be a good deal.
This solution can allow Intel to sell its own processors at lower prices (In order to counter attack AMD strategy), and to invest more money to develop new Archs (x86, ARM, GPGPU or VISC).
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