New NVIDIA patent: Performing on-chip partial good die identification - Bits and Chips Skin ADV
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Designing a microchip (CPU, GPU, SoC, FPGA, etc.) has proved to be more and more complex and expensive, so the companies are studying different methods to do a faster analysis and enhanced binning of chips produced.

XFR by AMD is one of these methods, as you can read here. In fact we have seen that the Ryzen 1800X is better than the Ryzen 1700X, and the Ryzen 1700X is better than the Ryzen 1700 with our own eyes.

 

 

NVIDIA, in Feb. 2016, has filed a patent called: “Performing on-chip partial good die identification”. Thanks to this technology, NVIDIA could make a faster and more precise binning of its GPUs (The GPU V100 is a Behemot! 815 mm2!): “Embodiments of the present invention relate generally to integrated circuit fabrication and testing and, more specifically, to performing on-chip partial good die identification”.

Also, hand-picking good GPUs will be probably easier than ever. Since NVIDIA filed this patent in Feb. 2016, we can say that we could see this technology utilized in consumer version of Volta uArch (2018) if we are lucky.

 


Pubblicato in: News, English News
Tags: binning , gpu , nvidia , patent , v100 , volta

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Gian Maria Forni
Autore: Gian Maria Forni
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Esperto di mercati e CPU
Sebbene sia laureato in Lettere e Filosofia, indirizzo Storia Contemporanea, e scriva per quotidiani e riviste di tale settore, ha sempre avuto la passione per l'informatica ed ha collaborato quale moderatore in importanti forum del settore
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