Let us spread some light on Skylake-E/EP/EX Dies. In several forums there is confusion about the Die utilized by Intel to produce the new Skylake-X SKUs. A lot of users don’t seem to know that Intel – for almost 10 years – use three kind of Die to produce its own Server SKUs in order to maximise profits: LCC (Low Core Count), MCC (Medium Core Count) and HCC (High Core Count).

For this reason we have to wait a little bit longer to see 14, 16 and 18 core variants of Skylake-X SKUs. These CPU are based on MCC Die (Up to 20 Core), while 6/8/10/12 variants are based on LCC Die (Up to 12 Core). Intel has always used only LCC Dies in its HEDT SKUs, until today.

Intel will have hard times to tweak the MCC Die in order to stay inside the TDP supported by LGA2066 Socket (140W, max 160W), and that’s why we could see a new revision of this socket (Intel engineers are still thinking how to solve this situation).

Autore: Gian Maria Forni
Esperto in: Esperto di mercati e CPU

Sebbene sia laureato in Lettere e Filosofia, indirizzo Storia Contemporanea, e scriva per quotidiani e riviste di tale settore, ha sempre avuto la passione per l'informatica ed ha collaborato quale moderatore in importanti forum del settore

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